电子制造工程专业英语

《电子制造工程专业英语来自》是2011年高等教育出版社出版的图书，作者是金鸿。本书主要讲了360百科电子制造工程专业的英语术语及用法，培养和提高读者阅读和翻译专业英语文制汉料载献资料的能力，为今后获罗取和交流专业技兵往超望改普信打术信息打下良好的基础。

• 书名 电子制造工程专业英语
• 页数 143页
• 出版社 高等教育出版社
• 装帧 平装

图书信息

　　正文语种: 英语, 简本造坏体中文

　　开本: 16

　　ISBN: 9787040324488

　　条形码: 97870403鲁数岁油井倒司24488

　　尺寸: 25.8 x 18 x 0.6 cm

　　重量: 计259 g

内容简介

　　全书共18独氧把课，内容包括电的本质、电场、简单电路、半导体材料、电化学来自基础、光化学基础、电子封装、印制电路板成像、电镀技术、柔性电路、柔声深甚厂换优技留性电路的检测、显示供两硫技术简介、液晶显示、等离子显示、发光二极管、半导体器件及集成电路、半导体制造工艺、封装及测试等。每课由课文、语法(或翻译或应用文)和扩展阅读组成。《电子制造工程专业英语》还简单介绍了翻译知识，并配有适量的练习与高口船训京特批改例扩展阅读材料，供教师选用360百科及学生自学用。

　　《电子制造工程专业程盐士够说善英语》内容新颖，图文蒸扬帝黄从来运十集诉并茂，浅显易学，可用作光电子技术、电子电路设计与工艺、微电子技术、光伏发电技术及应用等专业的专业英望被井府念供马汉语教材或教学参考书，也可供从事电子制造工程类专业的工程技术人员学习参考。

目录

　　Lesson One

　　Part I Intensive Reading: The Nature of Electricity

　　Part II Grammar来自: Parts of Speech

　　Par360百科t III Extensive Reading: Why do We Get a Shock from Electricity?

　　Lesson Two

　　Part I Intensive Reading: Electric Field, Potential an界兴若d Voltage

　　Part ]] Grammar: Prefix and Suffix

　　Part III Extensive Reading: Electric Field and Electric Field Lines

　　Lesson Three

　　Part I Inten离扩滑sive Reading: Simple Electric Circuit

　　Part II Grammar: Word-Formation

　　Part III Extensive Reading: DC Biasing--BJTs

　　Lesson Four

　　Part I Intensive Reading: Semiconductor Material

　　Part II Grammar: Word-activity

　　Part III Extensive Reading: Growth of Semiconductor Materials

　　Lesson Five

　　Part I Intensive Reading: Electrochemistry Basis

　　Part II Grammar: Sentence Backbones

　　Part III Extensive Reading: The History of Electrochemistry

　　Lesson Six

　　草翻然触排林住信值可Part I Intensi磁害再题破和分ve Reading: Photochemistry Basis

　　Part II Grammar : Sentence Elements

　　Part 1II Extensive Reading: Ph凯易期吧otolithography Introduction

　　Lesson Seven

　　Part I Intensive Reading宜边第: Electronic Package and High-density Interconnectivity

　　Part II Grammar: Complex Sentence I

　　Part III Extensive Reading: Electronic Packaging

　　Lesson Eight

　　Part I Intensive Readin看肉论g: Printed Circuit Board Imaging

　　Part II Grammar: Complex sentence II

　　Part III Extensive Reading: HannStar Board-GBM Consolidation to Create Largest PC越市双言段盟B Maker in Taiwan Province

　　Lesson Ni入计施设农干屋没部承ne

　　Part I I剂拉政子笑ntensive Reading : Plated-Through-H影切树华乱金深ole(PTH) 行副Technology

　　Part II Tran守细既slation Skills: Translation Stand任触层技ards and Process

　　Part III Extensive Reading: The Disadvantages of Pattern Plating

　　Lesson Ten

　　Part I Intensive Reading: Fle行突鸡热松决财民植xible Circu和常官模朝紧its

　　Part II Translation Skills: Co印吸专吸眼育审啊马哪哥nversion of Part of Speech

　　Part III Extensive Reading: Design of Flexible Circuits

　　Lesson Eleven

　　Part 流岩套并才浓程果区队I Intensive Reading: Inspection and Test of Flexible Circuits

　　Part I1 Translation Skills: Translation of Complex Sentences in Scientific English

　　Part III Extensive Reading: Printed Electronics Make PCB "Green Up"

　　Lesson Twelve

　　Part I Intensive Reading: Introduction of Display Technology

　　Part II Translation Skills: Amplification and Deletion

　　Part II Extensive Reading: Flat Panel Buying Tips

　　Lesson Thirteen

　　Part I Intensive Reading: Liquid Crystal Display

　　Part II Practical Writing: Resume

　　Part III Extensive Reading: High Luminance and Wide Color Gamut--for clear, vivid color

　　Lesson Fourteen

　　Part I Intensive Reading: Plasma Display Panel

　　Part II Practical Writing: Cover Letter

　　Part III Extensive Reading: Full HD Plasma Pane! Creates a True Full HD 3D World

　　Lesson Fifteen

　　Part I Intensive Reading: Light Emitting Diodes

　　Part II Practical Writing: Reference Letter

　　Part III Extensive Reading: Organic Light Emitting Diodes

　　Lesson Sixteen

　　Part I Intensive Reading: Semiconductor Devices and Integrated Circuits

　　Part II Practical Writing : Advertisement

　　Part III Extensive Reading: How Solar Cells Work?

　　Lesson Seventeen -

　　Part | Intensive Reading: Semiconductor Manufacturing Processes

　　Part II Practical Writing: Self-Introduction

　　Part III Extensive Reading : Photolithography

　　Lesson Eighteen

　　Part I Intensive Reading: Packaging and Testing

　　Part I1 Practical Writing : Work Report

　　Part III Extensive Reading: Chip Scale Package

　　Reference